Taiwan’s First All-Diamond-Cu Heat Spreader
Mastering Key Challenges such as Interface Bonding and Welding Reliability
Leading a New Era in High-Power Chip Cooling
Delivering >600 W/m·K Superior Thermal Performance for AI Servers and High-Performance Computing
All Made in Taiwan
Welding — Opening a New Era of High-Power Chip Cooling
Reliable Mass Production--
Fully In-House Technology Ensures Stable Supply to Global Server Leaders
Faster Delivery, Greater Reliability, Superior Cost Advantage
Twice as Fast-- Half the Delivery Time of Competitors
Better Cost-- 40–50% Lower Price than International Brands with Same Performance
Delivering >600 W/m·K Superior Thermal Performance for AI Servers and High-Performance Computing
Next-Generation GPU-HBM Roadmap
(More GPU & HBM Integrated Above Interposer)
Welding — Opening a New Era of High-Power Chip Cooling
Different Connection Methods
Product Applications
High Thermal Heat Spreader Roadmap
